The internet browser you are using is outdated, we recommend you to upgrade the browser for better user experience, such as Mozilla Firefox or Google Chrome X

Capability > PCBA DFM Analysis

PCBA DFM Analysis

Our PCBA DFM analysis just does like "virtual assembly" before real assembly production, to find possible problems that may happen in real production. This helps to correct potential mistakes and make correct assembled boards quickly.

      1、 Fiducial analysis 

      The Fiducial Analysis is a read-only action designed to check fiducial placement, exposure and spacing relative to other components and to each other. It acts upon the top or bottom signal layers, and refers to the corresponding component layer.

2Component Analysis

     The Component Analysis is a read-only action intended to check component placement relative to other components or to drill and route features. It operates on the top or bottom layers, and refers to the corresponding component layer.

     Components can be classified by package type as well as component type. This can be useful in assembly analysis, and you may want to relate to package types when designing ERF models.

3Padstack Analysis

     The Padstack Analysis action is intended to locate problems related to toeprint features (i.e. the toeprint padstack) and via features, regarding their status as ‘special’ pad features and taking into account the component to which they belong. It operates on top or bottom layers, and refers to corresponding component layers.

4Testpoint Analysis

     The Testpoint Analysis is a read-only action intended to detect issues related to testpoints, i.e. pads having an attribute designating them as testpoints. It addresses issues such as accessibility to testpoints by probes and coverage on the board. It operates on top or bottom layers, and refers to the corresponding component layer.

5Solderpaste Analysis

     Solderpaste Analysis is a read-only action that includes tests to verify correct placement of solderpaste on the board (solderpaste should be on all SMD pads and only there), and proper overlap between solderpaste and solder mask, between solderpaste and copper layers.

6Pin to Pad Analysis

     Pin to Pad Analysis is a read-only action intended to detect issues related to the suitable placement of each component in regard to pin and pad location, size and orientation. It operates on the top or bottom layer, and refers to the corresponding component layer. Components can be classified by package type and/or lead form as well as component type. This can be useful in assembly analysis, particularly pin to pad analysis, and you may want to relate to package type and/or lead form when designing ERF models.


PCB

PCB Assembly

Components